For connectors, mobile phones, PDAs, LCD iron frames, glue frames... In other words, the measurement of the side dimensions is the disadvantage of non-contact image measurement, such as:

• Connectors, mobile phones, PDAs: In the measurement must rely on the bottom surface as a datum, so the use of vertical measuring instruments, the workpiece must be standing on the parallel block measurement, otherwise you need to use horizontal measuring instruments and must correct the vertical surface in advance
• LCD frame, frame: In the optoelectronic industry, there are many side dimension measurements, but because the non-contact image measurement has a Z axis height limit (Z axis height is 100 ~ 300mm), so the contact measurement (3D probe), but because the probe contact measurement speed is slow and not costly, I gradually doubt whether I bought the wrong instrument

We have developed a series of optical reflectors dedicated to side measurement, which can be used in stereo microscopes, optical projectors, 2.5D image measurements, and non-contact three-dimensional elements